Sandisk Corporation, a global Flash and advanced memory technology innovator, today announced that the company has completed its separation from Western Digital and is now an independent public ...

According to a slide that Sandisk shared, HBF combines BiCS technology with CBA wafer bonding, allowing for efficient ...

Sandisk's upcoming 3D Matrix Memory promises DRAM-like performance at four times the capacity and half the cost.

The new 3D flash memory also ramps up density, with up to 332 memory layers, improving bit density by 59% over ...

Among the things that Sandisk discussed last week at its Investor Day were upcoming UltraQLC-based 1PB (1 petabyte) ...

Kioxia Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry ...

SanDisk separating from WDC, shows next generation storage capacity announcements, predicts undersupply by 2H 2025 and announces up to 128TB data center QLC SSDs.

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SanDisk, the flash storage division of Western Digital, unveiled a pair of new SSD platforms at an investor event last week.

More excitingly, Sandisk also took the opportunity to reveal details of a new, large capacity SSD arriving later in 2025. 1PB ...

SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...